SMT Process Engineering Manager
Confirmed on the employer's own hiring board on Nov 7, 2026. First seen by Alion on Nov 2, 2026.
Characterise PCB and BGA warpage and optimise reflow profiles for large, high-thermal-mass boards
Design and optimise stencils, and review and finalise custom pick-and-place nozzle designs
Review and validate process and tooling requirements, and provide hands-on support for process builds
Evaluate NUDD (New, Unique, Different, Difficult) processes, golden pFMEA, and CTQ parameters against product technology requirements
Prepare engineering reports based on product features and failure analysis results
Lead weekly internal and external meetings with customers and suppliers, including phase exit reviews
Support RFQs with cost estimates for NUDD processes
Drive technology development for large BGAs ahead of or in parallel with NPI
Requirements
Bachelor’s degree or above in Engineering, such as Electronics, Materials, Manufacturing, or a related field
Extensive hands-on SMT process engineering experience in EMS or electronics manufacturing, ideally on server, networking, or other complex, high-layer-count boards
Deep knowledge of solder materials, PCB materials, and surface finishes including OSP, ENIG, and ENEPIG, with proven DOE-based material qualification
Expert-level knowledge of SMT equipment including printers, SPI, placement, reflow, and AOI and AXI, covering configuration and capability
Strong experience with warpage characterisation, reflow profiling, and stencil design
NPI and customer-facing project experience, with knowledge of pFMEA, CTQ, and failure analysis methodology
Strong English communication skills