Senior / Process Associate Engineer
First seen by Alion on Oct 29, 2026.
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
To provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.
Key responsibilities
Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
Support small improvement projects assigned by Process Engineer
Act as communication channels to transmit all messages/information (in particular process change related) to production floor
Immediate response to analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with others Process Associate Engineer to clear equipment down times
What we're looking for
Diploma in any Engineering field
Ability to work 12 hours rotating shift
Positive mindset and ability to adapt to fast-paced working environment
Willingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure
Fresh graduate is encouraged to apply
Skills
Graduate Recruitment, communication channels, Resolving Product Problems, Urban Design, Process Improvement, Wafer Testing, shifts schedules, Asian Studies, Social Sciences, Data Engineering, Equipment Maintenance, Plasmas, real-time support, Engineering, Design Research, Work in A Fast Paced Environment