Senior Staff Package Engineer

Lattice Overview

There is energy here…energy you can feel crackling at any of our international locations. It’s an energy generated by enthusiasm for our work, for our teams, for our results, and for our customers. Lattice is a worldwide community of engineers, designers, and manufacturing operations specialists in partnership with world-class sales, marketing, and support teams, who are developing programmable logic solutions that are changing the industry. Our focus is on R&D, product innovation, and customer service, and to that focus, we bring total commitment and a keenly sharp competitive personality.

Energy feeds on energy. If you flourish in a fast paced, results-oriented environment, if you want to achieve individual success within a “team first” organization, and if you believe you can contribute and succeed in a demanding yet collegial atmosphere, then Lattice may well be just what you’re looking for.

Job Description:

Lattice is seeking candidates for the position of Senior Staff Package Engineer. This is a full-time position located in Taiwan.

Accountabilities:

• Lead development and qualification of new packages and platforms (wire bond, flip chip, wafer-level bumping/WLCSP and fan-out) for Lattice products, from concept through mass production.
• Drive OSAT partners in new platform, package structure and material development, including process flow definition, BOM selection and yield improvement.
• Evaluate package material properties and key factors for thermal and stress simulation; work with design and simulation teams to optimize package structure and reliability.
• Plan and review board-level and component-level reliability tests (JEDEC/IPC based) with REL labs, and lead failure analysis (FA), including customer return FA with OSAT.
• Apply 8D, MSA, SPC, APQP, control plan and PPAP methodologies; work with Package Integration and Quality teams to resolve package-related issues.
• Manage OSATs, substrate suppliers, flash/memory suppliers, REL labs and material vendors, including technical reviews, performance monitoring and qualification.
• Support Lattice supply chain management; international travel to supplier sites is expected.
• Collaborate with cross-functional teams in Lattice, including design, product engineering, test, quality, operations and marketing.
• Define the package technology roadmap and strategy for Lattice products, and own platform decisions across wire bond, flip chip, wafer-level bumping and fan-out.
• Lead and mentor package engineers; set priorities, review technical deliverables and build team capability.
• Lead executive-level technical and business reviews with OSATs and key suppliers, and drive escalations to resolution.
• Serve as the package technical authority for customer-facing issues, including customer return FA, 8D reports and corrective action closure.
• Define package qualification and reliability standards, and establish supplier scorecards and continuous improvement programs.
• Manage package budgets, cost-down programs and supplier selection strategy, with resource planning to meet product schedules.

Qualifications:

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering or a related field.
• Overall 14+ years of experience, including 8+ years in package engineering, with 6+ years of experience and technical leadership in new package platform development preferred for the manager level.
• Proven experience leading package development and new platform/product introduction from concept to mass production.
• Working knowledge of wire bond, flip chip, wafer-level bumping and fan-out package technologies.
• Knowledge of board-level and component-level reliability tests and failure analysis methods; familiar with JEDEC and IPC standards.
• Knowledge of yield improvement, package process flow, BOM selection, package material properties and key factors in thermal and stress simulation.
• Familiar with 8D reports, MSA, SPC, APQP, control plan and PPAP.
• Experience managing OSATs, substrate suppliers, flash/memory suppliers, REL labs and material vendors; able to lead OSATs in platform, structure and material development.
• Willingness to travel internationally.
• Demonstrated leadership experience: leading a team or cross-functional projects, mentoring engineers and influencing senior stakeholders.
• Communication skills are a must as this person will interact with engineers in different disciplines as well as with members of management, up to senior leadership.

Additional Information:

This position requires a successful background and reference checks and satisfactory proof of your right to work in:

Lattice recognizes that employees are its greatest asset and the driving force behind success in a highly competitive, global industry. Lattice continually strives to provide a comprehensive compensation and benefits program to attract, retain, motivate, reward and celebrate the highest caliber employees in the industry.

Lattice is an international, service-driven developer of innovative low cost, low power programmable design solutions. Our global workforce, some 1,000 strong, shares a total commitment to customer success and an unbending will to win. For more information about how our FPGA, CPLD and programmable power management devices help our customers unlock their innovation, visit www.latticesemi.com. You can also follow us via Twitter, Facebook, or RSS. At Lattice, we value the diversity of individuals, ideas, perspectives, insights and values, and what they bring to the workplace. Applications are welcome from all qualified candidates.