Automotive Packaging Engineer/Technical Manager
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Location
In office (Hsinchu)
Seniority
Staff
Confirmed on the employer's own hiring board on Oct 22, 2026. First seen by Alion on Mar 17, 2026. MediaTek scores A on the Alion truth index.
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MediaTek Inc. is a global fabless semiconductor company specializing in system-on-chip (SoC) architectures and digital multimedia processing technologies. The enterprise designs and markets integrated circuits for smartphones, smart home devices, IoT hardware, wireless connectivity solutions, automotive electronics, and custom AI chips for edge and cloud applications. Headquartered in Hsinchu, Taiwan, the organization operates an international network of research, development, and sales offices serving original equipment manufacturers (OEMs) and technology brands worldwide.
1. Automotive Packaging development, New product introduction, Mass production, Supplier management.
2. Develop and evaluate the advanced IC Package technology.
3. Collaborate with the assembly subcontractors to complete the technology development.
4. Qualification and yield improvement for the advanced IC Packages.
5. Audit subcontractors.
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