Advanced CPO Packaging Technology Development & Integration Manager/Engineer

MediaTek • Semiconductors • Wireless • 1 day ago
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Salary
≈ $37k – $95k per year (Estimated)
Location
In office (Hsinchu)

Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Sep 13, 2026.

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MediaTek

MediaTek Inc. is a global fabless semiconductor company specializing in system-on-chip (SoC) architectures and digital multimedia processing technologies. The enterprise designs and markets integrated circuits for smartphones, smart home devices, IoT hardware, wireless connectivity solutions, automotive electronics, and custom AI chips for edge and cloud applications. Headquartered in Hsinchu, Taiwan, the organization operates an international network of research, development, and sales offices serving original equipment manufacturers (OEMs) and technology brands worldwide.
mediatek.com • HQ: Hsinchu, Taiwan • Hardware • Wireless • Semiconductors • 1001-5000 employees • Est. 1997
1. Advanced Packaging Technology Development. Lead the feasibility assessment and development of Co-Packaged Optics (CPO) and advanced wafer-level/panel-level packaging technologies, including 2.5D, 3D, 3.5D integration, EMIB, Fan-Out, and other heterogeneous integration solutions.

2. New Product Introduction (NPI) and Manufacturing Yield Enhancement. Drive NPI activities from engineering builds to production ramp-up, including process planning, DOE development, yield analysis, root-cause investigation, and manufacturing yield improvement.

3. Packaging Solution Development. Develop and implement packaging solutions for Co-Packaged Optics (CPO), optical modules, and advanced logic-memory integration platforms, including HBM and LPDDR technologies.

4. Technology and Supply Chain Management. Collaborate with foundries, OSAT providers, optical component suppliers, module manufacturers, and substrate vendors to evaluate technology capabilities, conduct technical assessments, support cost analysis, and oversee manufacturing readiness.

5. Cross-Functional Project Leadership. Work closely with IC design, package design, testing, quality, and reliability teams to ensure technical requirements, project milestones, and product performance targets are successfully achieved.

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