Senior Director, Physical Design & Backend Engineering (HPC)

The Senior Director, Physical Design & Backend Engineering is accountable for end-to-end backend execution

across HPC SoC and MCU programs, including implementation, signoff, and convergence from RTL to GDS.

This role leads globally distributed engineering teams and ensures delivery of high-quality silicon on schedule,

meeting defined power, performance, and area (PPA) targets. The role operates at the intersection of execution,

technology enablement, and organizational leadership, driving consistency, scalability, and reliability across

multiple sites and concurrent programs.

Key Responsibilities

1. End-to-End Backend Execution

• Own full lifecycle delivery from RTL through physical implementation, signoff, and tape-out.
• Ensure predictable execution, design closure, and milestone adherence across all programs.
• Drive first-pass silicon success through robust methodologies and execution discipline.

2. Global Team Leadership

• Lead and scale large, geographically distributed backend engineering teams.
• Establish clear accountability, performance standards, and delivery ownership across sites.
• Build organizational capability to support multiple concurrent SoC and MCU programs.

3. PPA and Quality Accountability

• Own delivery against defined power, performance, and area (PPA) targets.
• Drive continuous improvement in cost, quality, and engineering efficiency.
• Ensure adherence to quality standards, signoff criteria, and validation requirements.

4. Technology and Methodology Enablement

• Enable adoption of advanced process nodes and associated design methodologies.
• Drive improvements in tools, flows, and engineering practices across implementation and signoff.
• Partner with foundries, EDA vendors, and internal teams to enhance design outcomes.

5. Cross-Functional Collaboration

• Partner with architecture, RTL, DFT, methodology, and product engineering teams.
• Ensure alignment between architectural intent and physical implementation feasibility.
• Support program execution through close collaboration with program and product leadership.

6. Organizational Execution and Scaling

• Standardize ways of working across global teams to reduce variability and improve predictability.
• Drive data-driven execution using metrics, KPIs, and performance tracking.
• Identify and remove bottlenecks impacting delivery timelines or quality

Experience

• Approximately 20+ years of experience in semiconductor design, with strong focus on physical design and

implementation.

• Proven experience leading large-scale, global engineering teams.
• Demonstrated track record of delivering complex SoC programs across multiple technology nodes.

Technical Expertise

• End-to-end RTL-to-GDSII flow, including synthesis, place and route, timing closure, and physical

verification.

• Advanced node implementation and signoff methodologies.
• Deep understanding of SoC and MCU design and integration.

Leadership Capabilities

• Ability to lead large, globally distributed teams in a matrixed environment.
• Strong execution focus with accountability for delivery outcomes.
• Effective cross-functional collaboration and stakeholder management.
• Data-driven decision-making and structured problem-solving.

Preferred Qualifications

• Experience in high-performance computing, automotive, or advanced SoC domains.
• Exposure to methodology and flow development at scale.
• Experience working across multiple geographies and cultures.

Key Success Measures

• On-time delivery of silicon across programs.
• Achievement of PPA and quality targets.
• Improvement in execution predictability and cycle time.
• Organizational scalability and capability development.

Scope and Impact

• Responsible for backend execution across multiple SoC and MCU programs.
• Direct leadership of large, multi-site engineering teams.
• Critical impact on silicon delivery timelines, product quality, and business outcomes.
• Key contributor to organizational execution capability and scalability within HPC.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.