XPU Business Development Leader

About TylSemi, Inc.

The Opportunity

The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?

That's what we solve. TylSemi builds the chiplet infrastructure IP - the IO, power delivery, and interconnect building blocks - that makes AI/HPC systems actually work at scale.

This isn't a nice-to-have. It's the critical path.

Why Now

The Market Window

The semiconductor industry is going through its biggest architectural shift in 40 years:

• Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
• Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI - they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
• IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.

Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.

Culture & Team: How We Work

No Politics, No Bureaucracy

There are no layers, no approval chains, no corporate theater.

• If you have an idea, we test it. If it works, we ship it.
• No endless meetings, no PowerPoint presentations to convince middle management.

Remote-Friendly, Global Team

• US team: Bay Area preferred, but we hire the best people regardless of location
• India team: Building a world-class design center in Bangalore

Move Fast, Ship Real Products

We're not a research project. We have paying customers, committed capital, and aggressive timelines.

This is a company, not a lifestyle business. We're building to win.

What We Value

• Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.
• Bias for action. We move fast. Analysis paralysis doesn't fly here.
• Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.
• Low ego, high standards. We don't care about titles or politics. We care about results.

The Ask

If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.

We're asking you to walk away from that and bet on us.

Here's why you should:

• The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.
• The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.
• The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
• The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.

This is the bet. Join us and build something that matters.

Or stay comfortable. No judgment.

But if you're the kind of person who wants to take the shot, we'd love to talk.

READY TO JOIN?

Role

Own customer and ecosystem development for TylSemi's product portfolio. You will identify and qualify target accounts in AI infrastructure market, engage architecture and procurement teams at hyperscalers and custom silicon builders, and translate customer platform requirements into product and roadmap inputs for R&D. You will also develop and manage relationships across the ecosystem - IP partners, OSATs, foundry ecosystem programs, and industry consortia.

Responsibilities

• Identify, qualify, and develop strategic accounts - hyperscalers, AI compute companies, and infrastructure semiconductor customers - from first contact through proposals and commercial agreement
• Engage customer architecture, platform, and procurement teams at the technical level; translate AI chip and chiplet platform requirements into actionable product specs for R&D
• Own the ecosystem partner map - IP vendors, OSATs, packaging partners, and foundry ecosystem programs; establish and maintain working relationships that support product and tape-out execution
• Drive participation in industry standards bodies and chiplet consortia (UCIe Consortium, PCI-SIG, CXL Consortium, OCP, IEEE, JEDEC etc.) to build visibility and influence roadmap alignment
• Develop and manage NDA pipeline, customer evaluation programs, and early-access engagements in coordination with engineering
• Produce and maintain account plans, pipeline tracking, and BD status reporting for leadership
• Represent TylSemi at industry events, customer briefings, and technical forums

Qualifications

• 10+ years in business development, FAE, or customer/product management roles in semiconductors, with direct exposure to advanced AI chips, accelerators, or chiplet-based silicon
• Established relationships across hyperscaler silicon teams, AI chip startups, or custom ASIC customers; able to open doors at the architecture level, not just procurement
• FAE or CPM background strongly preferred - technical depth to engage R&D and platform teams credibly on chiplet integration, UCIe, PCIe, or power delivery topics
• Experience working the ecosystem side: IP vendors, foundry BD programs, OSAT, or packaging partners
• Track record of moving deals from first contact to signed agreement in a technical, long-cycle semiconductor sales environment
• Comfortable operating without a large support structure - this role owns its own pipeline, materials, and follow-through
• US-based; ability to travel for customer and industry engagements

The pay range for this role is: 175,000 - 300,000 USD per year