Senior Process Engineer

1.Process Development:

• Operate and optimize Photolithography equipment for ASML i-Line Stepper Systems, by defining and tuning process recipes (focus, exposure dose, alignment, etc.)
• Perform routine process monitoring and troubleshooting on ASML i-Line steppers, including tool qualification, SPC tracking, and defect analysis, ensuring stable and repeatable process performance.
• Analyze process and metrology data to identify improvement opportunities, drive root-cause analysis, and implement robust corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability.
• Assist in MEMS technology development, focusing on the setup and optimization of Photolithography, Screen Printing, and Bonding processes in a semiconductor environment.
• Assist in the development, characterization, and optimization of Photolithography, Screen Printing, and Bonding processes for semiconductor manufacturing.

2.Process Monitoring and Control:

- Monitor and control process to ensure consistent and high-quality output.

- Troubleshoot process issues and implement corrective actions.

3. Documentation and Reporting:

- Maintain detailed documentation of process parameters, experiments, and results.

- Prepare technical reports and presentations to communicate findings and recommendations to the engineering team.

- Update process documentation and standard operating procedures (SOPs) as needed.

4.Collaboration and Teamwork:

- Work closely with cross-functional teams, including R&D, production, and quality assurance, to ensure seamless integration of photolithography, screen printing and bonding processes.

- Participate in team meetings and contribute to problem-solving discussions.

- Provide support to shift engineers and shift technicians as required.

5.Continuous Improvement:

- Participate in continuous improvement initiatives to enhance process efficiency, yield, and quality.

- Identify opportunities for process automation and implement solutions.

Requirements

Education:

Bachelor’s degree in electrical & Electronics, Mechatronics, Physics/Applied Physics, Materials Science, Chemical or Mechanical Engineering studies

Skill and abilities:

Understanding of photolithography or bonding principle and semiconductor process. Knowledge of EKRA printing and bonding processes will be considered an advantage.

Knowledge of data analysis and statistical process control.

Hands-on experience with photolithography equipment (Track: DNS/TEL, Stepper: Canon/ASML, Aligner: EVG/SUSS), Screen printing (EKRA) and Bonding (EVG) equipment is highly desirable.

Good communication and teamwork skills.

Work independently and able to do multitask effectively.