Technical Program Manager

We are looking for an experienced Technical Program Manager (TPM) who will be responsible for leading and executing multi-disciplinary engineering programs for a high-tech manufacturing environment . In this role, you will drive New Product Introduction (NPI), factory bring-up activities, process optimisation, and technical risk mitigation across the full manufacturing lifecycle, from prototype through to high-volume manufacturing (HVM).

Job Responsibilities

• Lead the full technical program lifecycle for introducing new products into the manufacturing facility, coordinating milestones across product design, process engineering, and production teams
• Apply hands-on knowledge of critical semiconductor packaging processes - including Die Bonding, Wire Bonding, and Active Alignment - to partner with engineering teams, translate technical specifications into manufacturing flows, and ensure smooth NPI handoffs to the factory floor
• Proactively identify and mitigate cross-functional risks affecting production timelines, including component shortages (lasers, photodetectors, ICs) and equipment delays
• Collaborate with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and conduct root-cause analysis on manufacturing failures
• Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking covering velocity, quality, capacity, and manufacturing yield
• Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress and critical path updates
• Champion operational excellence through standardisation across design, test, and production teams

Job Requirements

• Bachelor’s degree or above in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related discipline
• More than 8 years of experience in electronics, semiconductor, or optical module manufacturing
• More than 5 years in technical program management, engineering management, or technical project leadership within high-volume manufacturing environments
• Experience in optical module or datacom manufacturing is preferred
• Experience identifying and mitigating risks related to component supply, equipment readiness, and cross-functional dependencies
• Strong understanding of semiconductormanufacturing processes, including SMT/PCBA, Die Bond, Wire Bond, Active Alignment, Assembly, Test, and Burn-in
• Proven ability to manage NPI programs from prototype stage through to high-volume manufacturing
• Understanding of cost modelling, BOM structure, capacity planning, and line readiness
• Strong leadership and cross-functional coordination skills, with experience managing program dashboards and reporting
• Possess a background in process standardisation and operational excellence initiatives across engineering and production teams
• Familiarity with manufacturing metrics and quality frameworks, including FPY tracking, root-cause analysis, and yield improvement methodologies
• Excellent communication skills with the ability to engage both internal stakeholders and external customers

See the impact we’ve made at our Engineering Desk to view the engineering roles we’ve successfully filled for professionals like you.