(竹北)Application Engineer
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Salary
≈ $34k – $80k per year (Estimated)
Location
In office (Hsinchu)
Seniority
Junior · 1+ year exp
Confirmed on the employer's own hiring board on Sep 25, 2026. First seen by Alion on Sep 22, 2026.
Overview
Company
Impact
Profile match
Winbond Electronics manufactures specialty memory semiconductors. Its portfolio covers code storage flash, dynamic memory and secure devices. The company operates its own wafer fabrication plants.
工作內容
作為華邦的(竹北)Application Engineer，
1. Assist in testing and verification of Flash products.
2. Test plan and test report document preparation.
3. Technical documents preparation: Datasheet, errata, ISO and application note.
4. Test Board, Dome Board development.
5. Assist in preparing Verilog and IBIS model of Flash products.
工作地點竹北辦公室(新竹縣竹北市文興路二段539號)
條件要求
學歷要求：大學
科系要求：電機電子工程相關 │ 資訊工程相關 │
相關經驗：1年以上
語言能力：英文 高級 │ │
管理責任：No
輪班需求：No
出差需求：1個月以下
外派需求：No
其他條件：
1. Knowledgeable in Embedded system design.
2. Knowledgeable in Linux/Unix/U-boot systems.
3. Basic programming reading and writing abilities.
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