Signal Integrity Intern

Meta is seeking a platform Signal Integrity (SI) intern to join our Infra HDRTP team. The team is responsible for designing, optimizing, and validating cutting-edge hardware platforms for Meta's rapidly expanding AI, compute, storage, and network infrastructure. As a platform SI intern, you will contribute to the design phase of NPI projects, collaborating closely with XFN team members and ODM partners. This role offers hands-on experience with state-of-the-art hardware technologies and expert mentorship from seasoned professionals within the team.

This is a 12 week internship in Menlo Park, California.

Responsibilities

Collaborate on the development of AI and network hardware designs and system solutions, guiding them from conceptualization to deployment. Contribute to defining requirements for novel solutions and spearhead the design, development, and testing of passive and active electrical interfaces in the high-speed links (224Gbps+, PCIe Gen6+, and other interfaces). High-speed modeling and simulation (pre-layout and post-layout SI analysis). PCB stackup analysis and AC/DC power integrity validation. COM and IBIS-AMI model simulation. Designing, developing, and testing components, as well as creating software automation for systems and products leveraging diverse technologies. Work in a collaborative environment across Meta, with system suppliers and ASIC suppliers, to drive Meta's requirements for development, planning, operation, and fleet deployment.

Qualifications

Currently pursuing or holding a Master's degree in Electrical Engineering, Computer Science and Engineering, or a related field Demonstrated theoretical foundation and practical experience in electrical design and validation Experience with computer and server system architecture Proficiency in CAD software for 1)Schematic capture 2)PCB layout 3)ADS simulation Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment Intent to return to full-time degree program after completion of the internship Intent to return to degree-program after the completion of the internship/co-op Theoretical and practical knowledge in high speed signal integrity design and validation, as well as electromagnetic, antenna and microwave Experience with board design from schematic entry to board layout and fabrication Knowledge or experience in semiconductor devices, VLSI design, microelectronic device Experience with standard SI/PI tools (e.g. HFSS, CST, HyperLynx, ADS, Spice) Familiarity with IEEE 802.3.dj specifications as well as the COM tool Practical experience with lab tools (e.g. Spectrum Analyzer, VNA, TDR, and real-time or sampling scope) Demonstrated analytical and problem-solving skills, and able to work independently