Senior NPI Process Engineer (Material Characterization)
Confirmed on the employer's own hiring board on Nov 6, 2026. First seen by Alion on Oct 28, 2026. STMicroelectronics scores A on the Alion truth index.
OUR STORY
At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.
When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.
Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.
Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.
YOUR ROLE
STMicroelectronics (Malta) Ltd. is seeking to recruit a Senior NPI Process Engineer specializing in Material Characterization. In this role, you will investigate the physical, mechanical, thermal, and material phenomena that influence semiconductor packaging technologies and manufacturing processes. Through scientific experimentation, advanced metrology, statistical analysis, and predictive modeling, you will establish relationships between packaging materials, process parameters, package structures, and performance. Your findings will help build robust engineering knowledge and practical solutions to advance packaging technology and manufacturing.
Duties & Responsibilities
The responsibilities include, but are not limited to:
- Scientific Investigation: Investigate the physical, mechanical, thermal, and material interactions that influence semiconductor packaging technologies and manufacturing processes.
- Experimental Research: Formulate testable hypotheses and design structured experiments using Design of Experiments (DoE), statistical methods, and rigorous experimental protocols.
- Advanced Characterization: Apply appropriate analytical and measurement techniques to characterize packaging materials, process behavior, package structures, and performance.
- Metrology Development: Evaluate and develop measurement methods, accounting for accuracy, measurement uncertainty, repeatability, reproducibility, and scientific validity.
- Mechanism Understanding: Identify and explain cause-and-effect relationships, failure mechanisms, nonlinear interactions, and sources of variability that affect packaging processes and package performance.
- Modeling and Simulation: Develop empirical, statistical, and physics-based models to describe packaging process behavior, predict package performance, and support engineering decisions.
- Research: Collaborate with multidisciplinary engineering teams, research institutions, universities and leading semiconductor research institutes and pilot-line facilities.
- Knowledge Development: Document scientific findings, prepare technical reports, and translate experimental results into predictive understanding and reusable engineering methodologies for semiconductor packaging.
Skills & Qualifications
The ideal candidate shall:
- MSc in Material Science, Applied Physics or related scientific discipline combined with at least 3 years of relevant industrial or applied research experience.
- Strong foundation of material science fundamentals, particularly the relationships between processing, microstructure, material properties and performance, with hands-on experience in mechanical and physical material testing and failure analysis.
- Proven ability to design experiments and to analyze complex physical phenomena, establish quantitative relationships and identify underlying mechanism governing material and process behaviour.
- Knowledge of material characterization and advanced analytical techniques include thermal mechanical, microstructural and dimensional analysis
- Advanced data analysis and modeling skills using tools such as Python, JMP and exposure to finite element analysis tools.
ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.
At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.
To discover more, visit st.com/careers.