Senior PCB DFx Engineer
Confirmed on the employer's own hiring board on Oct 25, 2026. First seen by Alion on Sep 3, 2026.
One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
What you'll do
Join our Operations Engineering team as a technical leader focused on PCB materials and producibility, fabrication technologies, and design-for-excellence (DFx) for advanced electronic systems. You will partner with design, manufacturing, quality, program, and supplier teams to ensure robust, manufacturable, and highly reliable PCB designs supporting government, military, airborne, commercial, and space payload applications.
The day-to-day
Key responsibilities include:
- Guide in HDI, RF/microwave, high-speed digital, rigid-flex, and high-reliability PCB technologies
- Review stack-ups, materials, controlled impedance requirements, via structures, fabrication drawings, and manufacturing specifications
- Lead PCB Design for Fabrication reviews from concept through production
- Collaborate with global PCB fabrication suppliers to optimize yield, quality, cost, and schedule
- Drive root-cause investigations and corrective actions for fabrication and reliability issues
- Develop and maintain PCB design guidelines, standards, and procedures across the enterprise
- Support multiple concurrent development programs and critical design reviews
What you'll need
- 10+ years' experience in PCB fabrication, PCB technology, DFx, or PCB manufacturing engineering experience
- Extensive knowledge of HDI fabrication, micro-vias, sequential lamination, controlled impedance, RF materials, and PCB technologies built for high reliability
- Solid understanding of IPC standards including IPC-2221/2222, IPC-601X, IPC-A-600, IPC-A-610, and J-STD-001
- Familiarity with Mentor Xpedition, Zuken, Cadence Allegro, Valor, CAM350, Minitab, Jira, Agile, and Oracle
- Proven experience supporting aerospace, defense, military, airborne, or space hardware programs
- Demonstrated ability to manage numerous projects and influence technical decisions across multi-functional teams
- Excellent communication, leadership, and problem-solving skills
- Bachelor's degree in Engineering or equivilant experience
- US Government position. US Citizenship required
- Active DoD Secret Clearance or ability to obtain when administratively feasible
- Ability to travel up to 20%
What will help you on the job
- Experience with Class 3 and Space Addendum hardware
- Knowledge of RF/microwave and phased-array antenna PCB technologies
- IPC certifications (CID, CID+, CIT, or equivalent)
- Active DoD Secret Clearance
Salary range
$141,500.00 - $224,000.00 / annually.
For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $176,000.00- $264,000.00/ annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat’s comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits.
EEO Statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
Key responsibilities include:
- Guide in HDI, RF/microwave, high-speed digital, rigid-flex, and high-reliability PCB technologies
- Review stack-ups, materials, controlled impedance requirements, via structures, fabrication drawings, and manufacturing specifications
- Lead PCB Design for Fabrication reviews from concept through production
- Collaborate with global PCB fabrication suppliers to optimize yield, quality, cost, and schedule
- Drive root-cause investigations and corrective actions for fabrication and reliability issues
- Develop and maintain PCB design guidelines, standards, and procedures across the enterprise
- Support multiple concurrent development programs and critical design reviews
- 10+ years' experience in PCB fabrication, PCB technology, DFx, or PCB manufacturing engineering experience
- Extensive knowledge of HDI fabrication, micro-vias, sequential lamination, controlled impedance, RF materials, and PCB technologies built for high reliability
- Solid understanding of IPC standards including IPC-2221/2222, IPC-601X, IPC-A-600, IPC-A-610, and J-STD-001
- Familiarity with Mentor Xpedition, Zuken, Cadence Allegro, Valor, CAM350, Minitab, Jira, Agile, and Oracle
- Proven experience supporting aerospace, defense, military, airborne, or space hardware programs
- Demonstrated ability to manage numerous projects and influence technical decisions across multi-functional teams
- Excellent communication, leadership, and problem-solving skills
- Bachelor's degree in Engineering or equivilant experience
- US Government position. US Citizenship required
- Active DoD Secret Clearance or ability to obtain when administratively feasible
- Ability to travel up to 20%