Dry Etch Process Development

• Lead next-generation NAND dry etch technology development
• Drive innovation in advanced semiconductor process R&D

About Our Client

Our client is a globally recognised semiconductor technology leader at the forefront of memory and storage innovation. With a worldwide footprint spanning multiple countries, extensive R&D investments, and advanced manufacturing facilities, the organisation plays a significant role in enabling next-generation technologies across data centres, artificial intelligence, mobile devices, automotive applications, and cloud computing infrastructure.

Job Description

• Lead the development and optimisation of advanced dry etch processes supporting next-generation memory technologies.
• Drive process innovation to meet challenging device architecture, structural and electrical performance targets.
• Define and execute technology development strategies for critical semiconductor process modules.
• Partner closely with process integration, lithography, deposition, wet process, CMP and metallisation teams to solve complex manufacturing challenges.
• Collaborate with equipment engineering teams and suppliers to establish future hardware and capability roadmaps.
• Lead technical investigations, root cause analyses and problem-solving initiatives involving high aspect ratio and advanced pattern transfer applications.
• Present technical findings, project updates and development strategies to senior stakeholders while mentoring junior engineers and contributing to technical leadership initiatives.

The Successful Applicant

• Bachelor's, Master's or PhD in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Chemistry, Semiconductor Engineering or a related discipline.
• Strong experience supporting R&D and technology development programmes transitioning into manufacturing environments.
• Deep understanding of plasma etching fundamentals, plasma chemistry, surface interactions and transport phenomena.
• Proven track record leading complex technical projects and cross-functional engineering teams.
• Experience developing solutions for high aspect ratio etch applications and advanced pattern transfer challenges.
• Strong knowledge of semiconductor dry etch equipment, process characterisation methodologies and statistical process control.
• Experience managing supplier collaboration, technical evaluations and equipment development initiatives.
• Proficiency in data analysis tools and statistical software, with exposure to data science, Python, automation or AI-driven process optimisation considered advantageous.

What's on Offer

• Opportunity to contribute directly to the development of future-generation semiconductor memory technologies.
• Exposure to cutting-edge R&D programmes addressing some of the industry's most complex process integration challenges.
• Comprehensive learning and development programmes, including technical leadership training.
• International exposure through collaboration with global R&D, manufacturing and equipment partners.

Contact

Eugenia NG (Lic No: R1108105 / EA no:18S9099)

Quote job ref

JN-092026-7114173

Phone number

+65 6541 9961

Michael Page International Pte Ltd | Registration No. 199804751N

Skills

Plasma Etch, Collaborate With Engineers, Process & Technology Development, Electrical Design, metal manufacturing, Process Integration, Lithography, Wet Chemical Etching, Mentoring for Developers, Etching, Root Cause Problem Solving, chemical etching, Technical Leadership, Depositions, Present Findings, Wet Chemistry